1

labarai

Dalilai da mafita na reflow solder bukukuwa

Chengyuan mai kera reflow na siyarwa a cikin samarwa da masana'antu na dogon lokaci cewa manyan dalilan sake fitar da beads sune kamar haka:

1. A ingancin soldering sun fi mayar dogara a kan solder manna

Abubuwan da ke cikin ƙarfe a cikin manna mai siyar, matakin oxidation na foda na ƙarfe, da girman foda na ƙarfe duk na iya shafar haɓakar ƙwallan siyar.

2. Ragon karfe yana da tasiri mai girma

a.Buɗewar Stencil

Yawancin masana'antu za su buɗe stencil daidai da girman kushin, saboda yana da sauƙi a buga manna mai siyar zuwa ga abin rufe fuska da kuma samar da kwano beads, don haka yana da kyau a sami buɗewar stencil ɗin ƙasa da girman ainihin girman. .

b.Kauri na karfe raga

Baidu stencil gabaɗaya yana tsakanin 0.12 ~ 0.17mm, kauri yayi yawa zai haifar da “rushewa” na manna mai siyar, yana haifar da gwangwani.

3. Matsayin matsa lamba na injin sanyawa

Yin hawan shine idan matsa lamba ya yi yawa, za a matse manna mai siyar zuwa Layer resist Layer, don haka matsa lamba bai kamata ya zama babba ba.


Lokacin aikawa: Afrilu-06-2023