JUKI 3D solder manna dubawa inji, 3D allon dubawa inji (AOI/SPI) RV-2-3D ​​Featured Image

JUKI 3D solder manna dubawa inji, 3D allon dubawa inji (AOI / SPI) RV-2-3D

Siffofin:

Gane saurin haɓaka ta sabuwar naúrar 3D.Samun 0.41 sec / FOV da haɓaka 34% idan aka kwatanta da ƙirar da ta gabata.

Ƙaddamar da tsayi 0.1 μm, Maimaitawa 10 μm * Gane gagarumin ci gaba mai mahimmanci. Tare da sababbin ci gaban fasaha, samo hoton 3D mai haske da madaidaici.

Baya ga samfurin 2D na baya da yanayin tsari, an ƙara sabon yanayin samfuri na 3D.

Bugu da ƙari, haɓaka sabon algorithm don duba fillet.* 0402 Chip


Cikakken Bayani

Tags samfurin

Sunan samfurin RV-2-3D
Girman PWB 50mm × 50mm - 410mm × 300mm
50mm × 50mm - 630mm × 300mm (mafi girma PWB)*
FOV (mafi kyau) P-3D AOI 0.41s / firam
Ƙudurin dubawa 15μm (Standard resloution), 10μm (High ƙuduri)*
Ƙudurin dubawa 15μm (Standar resloution), 10μm (High ƙuduri)*
Abu na dubawa Bangaren da ya ɓace, Matsar da wuri, Polarity, Juya baya/juyawa, Ba a siyar da shi, Gada, Yawan solder, Rashin ɓangaren sakawa, Gane hali*